• Board Layers: Single-sided / Double-sided / Multilayer
• Board Quantity: Prototyping & small batches supported
• Board Size (Length × Width) Max dimension: 234×490mm
• Solder Mask Color: Yellow, Black, White; Yellow is commonly used
• Board Thickness: Finished thickness, excluding stiffener thickness
• Copper Foil Thickness: Copper thickness of FPC circuit layer, matched with board thickness
• Minimum Line Width / Line Spacing，Recommended ≥3/3mil
• Minimum Via / PadRecommended via inner diameter: 0.3mm, outer diameter: 0.55mm
• Generally, smaller vias lead to higher cost
• Solder Mask Coverage：Via Tenting (Default)
• Minimum Solder Mask Bridge Width：Min width: 0.5mm.
• PI Stiffener: Widely used for gold finger connector products
• FR4: Suitable for reinforcement of component mounting area
• Steel Stiffener: Higher cost, good flatness & anti-deformation; for chip SMD. Not recommended for Hall sensor products
• 3M Adhesive: Used for FPC fixation during assembly
• Electromagnetic Shielding Film: Solve EMC issues. Ground opening on solder mask to connect ground copper for better shielding
• Panel spacing ≥2mm; 3mm spacing required for boards with steel stiffener